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Lucie Parietti
Chris Potter
Tim Thompson
Dick Martin
ESA-DE (Design Engineering)

Prepared for

Jan Boissevain
Barbara Jacak
Jon Kapustinsky
Jehanne Simon-Gillo
P-25 (Subatomic Physics)

January 1996

• Report Summary (All)
• 1. Introduction (Parietti)
• 2. Electronics cooling (Parietti)
  • 2.1. Heating of air along a channel in the flow direction
  • 2.2. MCM-to-air thermal exchange
  • 2.3. MCM heat spreading
  • 2.4. MCM cooling summary
  • References
  • Appendix 2A
• 3. Fluid-induced vibrations (Martin)
• 4. Gravitational Displacement of MVD Frame (Potter)
  • 4.1. Problem Statement
  • 4.2. Distributed Load Model
  • 4.3. Stress and Buckling of Foam Members
  • 4.4. FEA Verification of Deflection
  • 4.5. Comparison of Results
  • 4.6. Displacement Conclusion
  • Appendix 4A: Gravitational Displacement of MVD Frame
    • 4A1. Material Properties
    • 4A2. Continuous Beam Calculation
    • 4A3. Distributed Loads For FEA Model
    • 4A4. FEA Verification of Continuous Beam Model
    • 4A5. Program Listing for Beam Chart Calculation, "BEAM.BAS"
• 5. Hydroscopic Expansion of Foam (Potter)
  • 5.1. Problem Statement
  • 5.2. Hand Calculation
  • 5.3. Single C-Module FEA
  • 5.4. Fine Mesh FEA Model
  • 5.5. Conclusion
  • 5.6. Recommendations
  • Appendix 5A: Calculation of Stress Resulting From Linear Expansion
• 6. Conclusions (All)
• 7. Recommendations (All)

Last Updated: 16 May, 1996