MVD Year-3











On the left is shown the year-3 configuration of the MVD. The inner barrel is fully occupied, and the bottom rows of the outer barrel are populated. The cages toward the center are unmodified, and cages in red are changed from last year. The A, B, (C, D) indicate the rating of the MCM that services the silicon in this position, as far as this is assigned at the moment.
  1. Fewer than 10/256 dead channels
  2. Fewer than 32/256 dead channels
  3. 1 block (32/256) dead channels
  4. 2 blocks (64/256) dead channels

    In addition, both end caps are fully populated with pad detectors.

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Shown is a map of the current state of the remaining silicon assembly. From left to right, the steps involve: MCM is bonded to an output cable, sent off to Pace for wirebonding. Silicon is bonded to Kapton cable and sent to Pace. These 2 subassemblies are joined and sent to Pace. Upon return, they are tested with an LED, a bias tab is epoxied to the back of the silicon, then the Kapton cable is pre-folded, and the bias tab is soldered onto the back of the Kapton cable. Finally, the full assemblies are glued onto the C-cage, in order OB, IB, IM, IT (outer bottom, inner bottom, inner middle, inner top).

The total number of cages in the MVD is 24. 11 were completed last year, and 3 more have been finished this year. Thus 10 are still under construction. The numbers in ovals indicate how many (sub-) assemblies still need work.

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Pictures of the procedure are here.









The final assembly procedure.

Pictures of the (dis-)assembly are here.

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pictures

Toshi's table

Last update 30 Oct 2002 - HvH
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