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 | On the left is shown the year-3 configuration of the MVD.
 The inner barrel is fully occupied, and the bottom rows of the outer barrel
 are populated. The cages toward the center are unmodified, and cages in red
 are changed from last year. The A, B, (C, D) indicate the rating of
 the MCM that services the silicon in this position, as far as this is assigned 
 at the moment. 
     Fewer than 10/256 dead channels
     Fewer than 32/256 dead channels
     1 block  (32/256) dead channels
     2 blocks (64/256) dead channels
  
 
 In addition, both end caps are fully populated with pad detectors.
 
 <- ps
 
    | 
 
 
 
 
 
 
 
 |  
    |   
 
 
 
 
 
 
 | Shown is a map of the current state of the remaining silicon assembly. 
From left to 
right, the steps involve: MCM is bonded to an output cable, sent off to 
Pace for wirebonding. Silicon is bonded to Kapton cable and sent to Pace. 
These 2 subassemblies are joined and sent to Pace. Upon return, they are
 tested with an LED, a bias tab is epoxied to the back of the silicon,
 then the Kapton cable is pre-folded, and the bias tab is soldered onto
 the back of the Kapton cable. Finally, the full assemblies 
 are  glued onto the C-cage, in order OB, IB, IM, IT (outer bottom, inner
 bottom, inner middle, inner top). 
 The total number of cages in the MVD is 24. 11 were completed last year, and
 3 more have been finished this year. Thus 10 are still under 
construction. The numbers in ovals indicate how
 many (sub-) assemblies still need work.
 
 <- ps
 
 Pictures of the procedure are 
    here.
 
 
 |  
    | 
 
 
 
 
 
 
 
 |  
  |   | The final assembly procedure. 
 Pictures of the (dis-)assembly are
     here.
 
 <- ps
 |  |