(Eric Bosze, with Mark Pollack)
Web interface to the BNL Oracle data base. This will be loaded with data
from testing and assembly sites
at UC Riverside, U of Alabama, LANL
Defined specs for the FEE component test
stand
(Sang Yeol Kim, Nance Ericson, Hubert van Hecke)
For testing incoming FEE components: DCM, timing and trigger interface
boards, DCMs etc.
Revisited mechanical tolerances
(Hubert van Hecke, Eric Bosze)
Defined silicon wafer angular and z-position tolerances, and the allowed
local humidity excursions.
Some slides
from this other talk, in particular I showed
slides 1,
4,
5,
6,
7,
11.
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