Employ Chip Scale Packaging
- Allows use of conventional board (eliminate MCM)
- Economical Rework
- Allows use of commercial Known Good Die for Xilinx Parts
- Allows lower standard of testing because of cheap rework
- Burn in becomes inexpensive or may be eliminated
- Grad Student test execution possible
Next: Graph of MCM Yield vs. Chip Quality
Tony Moore (moore@icsun1.ic.ornl.gov
)