Electronics Impact on Mechanical Design
- MCM Size (assumes HDI process) 6/97
- Central Plenum
- Pad/MCM Plenum (2)
- Power/Communication Circuit Board (2)
- Motherboard (2)
- Daughterboard (2)
- MCM Technology Change (not HDI)
- Radial Boundary
- MVD Length - must be increased => nosecones
- => Complete mechanical redesign
- MVD Signals 6/97
- MCM and Output Cable Design
- Motherboard Design (2)
- Daughterboard Design (2)
- Power/Communications Circuit Board Design (2)
- DCM Interface Design
- Trigger Interface Design
- Timing & Control Interface Design
- Technology Choice of LVDS over Fiber-Optics 3/97
- Forced change to JAE 160 contact (2 x 80)
- 0.8mm pitch surface mount connector
- otherwise - Radial Boundary change
- Motherboard 6/97
- Pad Detector/MCM Support
- Pad/MCM Plenum Cover
- Connector Change => Endplate Changes
- &Radial Envelope