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The FVTX Wedge
The following image is clickable and can be used to get current drawings, information about FPHX chips, Sensor, HDI, and backplane.
Current Design Status
- FVTX Design Revisions Identified from prototypes are listed here
Wedge Assembly
Wedge assembly dimensions (13-Mar-09) (pdf) and shown here in jpg format:
Some current dimensions pertinent to wedge assemblies (May 30, 2008) are given below:
| Sensor to FPHX chip | 300.0 microns |
| Width of the FPHX chip | 2850.0 microns |
| Length of the FPHX chip | 9208.8 microns |
| Height of the FPHX chip | 320 microns |
| Height of the Silicon Sensor | 320 microns |
| FPHX chip to wire bond pad on HDI | 200.0 microns |
| Radial length of pad | 200.0 microns (pad is 150 X 200) |
| Pad edge to carbon backing edge | 300.0 microns |
| Edge of carbon backing edge to closest HDI component | 550.0 microns |
| Stay clear distance on backside of HDI to any component | 200.0 microns |
Last update by Melynda Brooks